Home  | Legals | Data Protection | Sitemap | KIT


Publications of 2013


List publications according to year

All | 2017 | 2016 | 2015 | 2014 | 2013 | 2012 | 2011

List publications according to type

All | Journal Articles | Conference Contributions | Lectures


Conference Contributions (5)

  • Koos, C.; Freude, W.; Leuthold, J.; Alloatti, L.; Palmer, R.; Korn, D.; Pfeifle, J.; Schindler, P. C.; Lauermann, M.; Lindenmann, N.; Koeber, S.; Hoose, T.; Billah, M. R.; Yu, H.; Bogaerts, W.; Baets, R.; Fournier, M.; Fedeli, J.-M.; Dinu, R.; Bolten, J.; Wahlbrink, T.; Waldow, M.
    Silicon-organic hybrid integration and photonic wire bonding: Enabling technologies for heterogeneous photonic systems
    Frontiers in Optics (FiO'13), Orlando (FL), USA, October 05–10 , paper FTu1E.3 Optical Society of America (OSA) (2013) [DOI] (invited)

  • Koos, C.; Freude, W.; Leuthold, J.; Alloatti, L.; Palmer, R.; Korn, D.; Pfeifle, J.; Schindler, P. C.; Lauermann, M.; Nesic, A.; Lindenmann, N.; Koeber, S.; Hoose, T.; Billah, M. R.
    Silicon-organic hybrid (SOH) integration, photonic wire bonding, and frequency combs: Technologies for multi-terabit/s interconnects
    International Nano-Optoelectronics Workshop iNOW-2013, Cargèse, France, August 19-30 (2013) (invited)

  • Koos, C.; Freude, W.; Leuthold, J.; Lindenmann, N.; Koeber, S.; Hoffmann, J.; Hoose, T.; Hubner, P.; Billah, M. R.
    Photonic wire bonding: An enabling technology for heterogeneous multi-chip integration
    Advanced Photonics 2013: Integrated Photonics Research, Silicon and Nanophotonics (IPR'13), July 14–17 , paper IM4A.3 Optical Society of America (OSA), Rio Grande, Puerto Rico, USA (2013) [DOI] (invited)

  • Koos, C.; Leuthold, J.; Freude, W.; Lindenmann, N.; Koeber, S.; Hoffmann, J.; Hoose, T.; Hubner, P.
    Photonic wire bonding: Nanophotonic interconnects fabricated by direct-write 3D lithography
    15th International Conference on Transparent Optical Networks (ICTON), 2013, June 23-27 , paper We.C2.4, Cartagena, Spain, June (2013) [DOI] (invited)

  • Koos, C.; Leuthold, J.; Freude, W.; Alloatti, L.; Korn, D.; Palmer, R.; Lauermann, M.; Pfeifle, J.; Lindenmann, N.; Koeber, S.; Hillerkuss, D.; Schmogrow, R.
    Silicon photonics, hybrid integration and photonic wire bonding – enablers for energy-efficient terabit/s interconnects
    13th FIBER OPTICS EXPO Technical Conference, Tokyo, Japan, April 10-12 (2013) (invited)