Photonic Wirebonding for Optical Multi-Chip Systems (PHOIBOS)
Besides facilitated fiber-chip coupling, photonic wire bonds enable optoelectronic multi-chip assemblies that combine the strengths of best-in-class integration platforms such as
- III-V compound semiconductors for optical sources,
- silicon photonics for highy-density photonic-electronic cointegration, and
- silicon nitride and related material systems for high-quality passive devices.
Photonic multi-chip integration enables optoelectronic systems with unprecedented performance and flexibility and is a key concept to cope with upcoming challenges in information and communication technology