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Publications of 2016

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Journal Articles (2)

  • Goering, G.; Dietrich, P.-I.; Blaicher, M.; Sharma, S.; Korvink, J.; Schimmel, T.; Koos, C.; Hoelscher, H.
    Tailored probes for atomic force microscopy fabricated by two-photon polymerization
    Applied Physics Letters 109, 063101 (2016) [DOI]

  • Schneider, S.; Lauermann, M.; Dietrich, P.-I.; Weimann, C.; Freude, W.; Koos, C.
    Optical coherence tomography system mass-producible on a silicon photonic chip
    Opt. Express 24, 1573-1586 (2016) [DOI]

Conference Contributions (4)

  • Nesic, A.; Blaicher, M.; Hoose, T.; Lauermann, M.; Kutuvantavida, Y.; Freude, W.; Koos, C.
    Hybrid 2D/3D photonic integration for non-planar circuit topologies
    42nd European Conf. Opt. Commun. (ECOC'16), Düsseldorf, Germany, Sept. 18–22 (2016) more

  • Dietrich, P.-I.; Reuter, I.; Blaicher, M.; Schneider, S.; Billah, M. R.; Hoose, T.; Hofmann, A.; Caer, C.; Dangel, R.; Offrein, B.; Moehrle, M.; Troppenz, U.; Zander, M.; Freude, W.; Koos, C.
    Lenses for Low-Loss Chip-to-Fiber and Fiber-to-Fiber Coupling Fabricated by 3D Direct-Write Lithography
    Conf. on Lasers and Electro-Optics (CLEO'16), San Jose (CA), USA, June 5 – 10 , paper SM1G.4. (2016) [DOI]

  • Koos, C.; Freude, W.; Leuthold, J.; Dalton, L. R.; Wolf, S.; Zwickel, H.; Hoose, T.; Billah, M. R.; Lauermann, M.; Weimann, C.; Hartmann, W.; Melikyan, A.; Lindenmann, N.; Koeber, S.; Palmer, R.; Alloatti, L.; Giesecke, A. L.; Wahlbrink, T.
    Silicon-organic hybrid (SOH) integration and photonic multi-chip systems: Technologies for high-speed optical interconnects
    Optical Interconnects Conference (OI'16), Hyatt Regency Mission Bay Spa & Marina, San Diego, California, USA, May 9-11 (2016) [DOI] (invited)

  • Hoose, T.; Billah, M. R.; Marin-Palomo, P.; Blaicher, M.; Dietrich, P.-I.; Hofmann, A.; Troppenz, U.; Moehrle, M.; Lindenmann, N.; Thiel, M.; Simon, P.; Hoffmann, J.; Goedecke, M. L.; Freude, W.; Koos, C.
    Multi-Chip Integration by Photonic Wire Bonding: Connecting Surface and Edge Emitting Lasers to Silicon Chips
    Optical Fiber Communication Conference (OFC'16), Anaheim (CA), USA, March 20–24 , paper M2I.7 (2016) [DOI]