Publications of type Lecture
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Lectures (4)
- Mai, C.; Lischke, S.; Kroh, M.; Hoose, T.; Lindenmann, N.; Koos, C.; Mai, A.; Zimmermann, L.
Optische Schnittstelle für photonische Wirebonds in photonischer BiCMOS-Technologie
MikroSystemTechnik-Kongress 2015, Karlsruhe, Germany, Oct. 26–28 (2015) - Koos, C.
Photonic wire bonding, multi-chip integration, and wafer-level micro-optics enabled by 3D laser lithography
Sino-German Workshop on Photonic Manufacturing, Manipulation and Measurement (PMMM2015), July 2-7, Changchun, China (2015) (invited) - Lindenmann, N.; Hoose, T.; Steenhusen, S.; Billah, M. R.; Koeber, S.; Houbertz-Krauss, R.; Koos, C.
Photonic wire bonding as an enabling technology for multi-chip photonic system
OPTO SPIE Photonics West (OPTO-SPIE'14) , San Francisco (CA), USA, Feb. 1-6 (2014) - Koos, C.; Leuthold, J.; Freude, W.; Alloatti, L.; Korn, D.; Palmer, R.; Lauermann, M.; Pfeifle, J.; Lindenmann, N.; Koeber, S.; Hillerkuss, D.; Schmogrow, R.
Silicon photonics, hybrid integration and photonic wire bonding – enablers for energy-efficient terabit/s interconnects
13th FIBER OPTICS EXPO Technical Conference, Tokyo, Japan, April 10-12 (2013) (invited)