Publications of type Lecture

Lectures (4)

• Mai, C.; Lischke, S.; Kroh, M.; Hoose, T.; Lindenmann, N.; Koos, C.; Mai, A.; Zimmermann, L.
  Optische Schnittstelle für photonische Wirebonds in photonischer BiCMOS-Technologie
  MikroSystemTechnik-Kongress 2015, Karlsruhe, Germany, Oct. 26–28 (2015)


• Koos, C.
  Photonic wire bonding, multi-chip integration, and wafer-level micro-optics enabled by 3D laser lithography
  Sino-German Workshop on Photonic Manufacturing, Manipulation and Measurement （PMMM2015）, July 2-7, Changchun, China (2015) (invited)


• Lindenmann, N.; Hoose, T.; Steenhusen, S.; Billah, M. R.; Koeber, S.; Houbertz-Krauss, R.; Koos, C.
  Photonic wire bonding as an enabling technology for multi-chip photonic system
  OPTO SPIE Photonics West (OPTO-SPIE'14) , San Francisco (CA), USA, Feb. 1-6 (2014)


• Koos, C.; Leuthold, J.; Freude, W.; Alloatti, L.; Korn, D.; Palmer, R.; Lauermann, M.; Pfeifle, J.; Lindenmann, N.; Koeber, S.; Hillerkuss, D.; Schmogrow, R.
  Silicon photonics, hybrid integration and photonic wire bonding – enablers for energy-efficient terabit/s interconnects
  13th FIBER OPTICS EXPO Technical Conference, Tokyo, Japan, April 10-12 (2013) (invited)