Publications of type Inproceedings

Billah, M. R.; Blaicher, M.; Kemal, J. N.; Hoose, T.; Zwickel, H.; Dietrich, P.-I.; Troppenz, U.; Moehrle, M.; Merget, F.; Hofmann, A.; Witzens, J.; Randel, S.; Freude, W.; Koos, C.
8-channel 448 Gbit/s Silicon Photonic Transmitter Enabled by Photonic Wire Bonding
Optical Fiber Communication Conference (OFC'17), Los Angeles (CA), USA, March 19–23 , paper Th5D.6. (2017) [DOI] (postdeadline)

Dietrich, P.-I.; Reuter, I.; Blaicher, M.; Schneider, S.; Billah, M. R.; Hoose, T.; Hofmann, A.; Caer, C.; Dangel, R.; Offrein, B.; Moehrle, M.; Troppenz, U.; Zander, M.; Freude, W.; Koos, C.
Lenses for Low-Loss Chip-to-Fiber and Fiber-to-Fiber Coupling Fabricated by 3D Direct-Write Lithography
Conf. on Lasers and Electro-Optics (CLEO'16), San Jose (CA), USA, June 5 – 10 , paper SM1G.4. (2016) [DOI]

Hoose, T.; Billah, M. R.; Marin-Palomo, P.; Blaicher, M.; Dietrich, P.-I.; Hofmann, A.; Troppenz, U.; Moehrle, M.; Lindenmann, N.; Thiel, M.; Simon, P.; Hoffmann, J.; Goedecke, M. L.; Freude, W.; Koos, C.
Multi-Chip Integration by Photonic Wire Bonding: Connecting Surface and Edge Emitting Lasers to Silicon Chips
Optical Fiber Communication Conference (OFC'16), Anaheim (CA), USA, March 20–24 , paper M2I.7 (2016) [DOI]

Dietrich, P.-I.; Wondimu, S. F.; Wienhold, T.; Steidle, M.; Hofmann, A.; Lindenmann, N.; Billah, M. R.; Hoose, T.; Blaicher, M.; Freude, W.; Koos, C.
Herstellung mikrooptischer Komponenten durch Zwei-Photonen-Polymerisation
MikroSystemTechnik-Kongress 2015, Karlsruhe, Germany, Oct. 26–28 , EDAS Paper-ID 1570106799 (2015) more

Billah, M. R.; Hoose, T.; Onanuga, T.; Lindenmann, N.; Dietrich, P.-I.; Wingert, T.; Goedecke, M. L.; Hofmann, A.; Troppenz, U.; Sigmund, A.; Moehrle, M.; Freude, W.; Koos, C.
Multi-Chip Integration of Lasers and Silicon Photonics by Photonic Wire Bonding
Conf. on Lasers and Electro-Optics (CLEO'15), San Jose (CA), USA, May 10–15 , paper STu2F.2. Optical Society of America (OSA) (2015) [DOI]

Nesic, A.; Palmer, R.; Koeber, S.; Korn, D.; Koenig, S.; Elder, D. L.; Dalton, L. R.; Freude, W.; Koos, C.
Demonstration of Difference Frequency Generation in a Silicon Slot Waveguide
Conf. on Lasers and Electro-Optics (CLEO'14), San Jose (CA), USA, June 8–13 , STh1I.2 Optical Society of America (2014) [DOI]

Lindenmann, N.; Dottermusch, S.; Hoose, T.; Billah, M. R.; Koeber, S.; Freude, W.; Koos, C.
Connecting silicon photonic circuits to multi-core fibers by photonic wire bonding
Optical Interconnects Conference (OI'14), Loews Coronado Bay, Coronado, California, USA, , 131-132 IEEE, May 4-7 (2014) [DOI]

Koos, C.; Freude, W.; Lindenmann, N.; Koeber, S.; Hoose, T.; Billah, M. R.
Three-dimensional two-photon lithography: an enabling technology for photonic wire bonding and multi-chip integration
SPIE 8970 (LASE-SPIE'14), Laser 3D Manufacturing, March , paper 897008 (2014) [DOI] (invited)

Koos, C.; Freude, W.; Leuthold, J.; Alloatti, L.; Palmer, R.; Korn, D.; Pfeifle, J.; Schindler, P. C.; Lauermann, M.; Lindenmann, N.; Koeber, S.; Hoose, T.; Billah, M. R.; Yu, H.; Bogaerts, W.; Baets, R.; Fournier, M.; Fedeli, J.-M.; Dinu, R.; Bolten, J.; Wahlbrink, T.; Waldow, M.
Silicon-organic hybrid integration and photonic wire bonding: Enabling technologies for heterogeneous photonic systems
Frontiers in Optics (FiO'13), Orlando (FL), USA, October 05–10 , paper FTu1E.3 Optical Society of America (OSA) (2013) [DOI] (invited)

Koos, C.; Freude, W.; Leuthold, J.; Alloatti, L.; Palmer, R.; Korn, D.; Pfeifle, J.; Schindler, P. C.; Lauermann, M.; Nesic, A.; Lindenmann, N.; Koeber, S.; Hoose, T.; Billah, M. R.
Silicon-organic hybrid (SOH) integration, photonic wire bonding, and frequency combs: Technologies for multi-terabit/s interconnects
International Nano-Optoelectronics Workshop iNOW-2013, Cargèse, France, August 19-30 , paper 7483033 (2013) [DOI] (invited)

Koos, C.; Freude, W.; Leuthold, J.; Lindenmann, N.; Koeber, S.; Hoffmann, J.; Hoose, T.; Hubner, P.; Billah, M. R.
Photonic wire bonding: An enabling technology for heterogeneous multi-chip integration
Advanced Photonics 2013: Integrated Photonics Research, Silicon and Nanophotonics (IPR'13), July 14–17 , paper IM4A.3 Optical Society of America (OSA), Rio Grande, Puerto Rico, USA (2013) [DOI] (invited)

Koos, C.; Leuthold, J.; Freude, W.; Lindenmann, N.; Koeber, S.; Hoffmann, J.; Hoose, T.; Hubner, P.
Photonic wire bonding: Nanophotonic interconnects fabricated by direct-write 3D lithography
15th International Conference on Transparent Optical Networks (ICTON), 2013, June 23-27 , paper We.C2.4, Cartagena, Spain, June (2013) [DOI] (invited)

Lindenmann, N.; Balthasar, G.; Leuthold, J.; Freude, W.; Koos, C.
Broadband low-loss interconnects enabled by photonic wire bonding
Optical Interconnects Conference (OI'12), Santa Fe, New Mexico, USA, May 20-23 , 125-126, Paper WC1 IEEE, May (2012) [DOI] (invited)

Lindenmann, N.; Balthasar, G.; Jordan, M.; Hillerkuss, D.; Schmogrow, R.; Freude, W.; Leuthold, J.; Koos, C.
Low-Loss Photonic Wire Bond Interconnects Enabling 5 TBit/s Data Transmission
Optical Fiber Communication Conference (OFC'12), Los Angeles (CA), USA, 2012, March 06-10 , paper OW4I.4 Optical Society of America (OSA) (2012) [DOI]

Lindenmann, N.; Kaiser, I.; Balthasar, G.; Bonk, R.; Hillerkuss, D.; Freude, W.; Leuthold, J.; Koos, C.
Photonic Waveguide Bonds - A Novel Concept for Chip-to-Chip Interconnects
Optical Fiber Communication Conference/National Fiber Optic Engineers Conference 2011 , paper PDPC1 Optical Society of America (2011) [DOI]